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LMS: bump version to 2119.0.0.0
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Bump version  to 2119.0.0.0

Signed-off-by: Alexander Usyskin <alexander.usyskin@intel.com>
Signed-off-by: Tomas Winkler <tomas.winkler@intel.com>
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ausyskin authored and Tomas Winkler committed May 20, 2021
1 parent 22ccf06 commit b88661b
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8 changes: 8 additions & 0 deletions CHANGELOG.md
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## [2119.0.0.0]

### Fixed
- Configurator: adhere for new MEI device naming scheme

### Changed
- Build: use ACE 7.0.1

## [2118.0.0.0]

### Fixed
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2 changes: 1 addition & 1 deletion VERSION
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2118.0.0.0
2119.0.0.0

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